Resin composition for low expansion moldings

Details Resin composition for low expansion moldings Resin composition for low expansion moldings

1995-09-06

1998-01-27

Cooney, Jr., John M.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Cellular products or processes of preparing a cellular...

521123, 521128, 521130, 521143, 521145, 521146, 521147, 521149, 525 56, 525 57, 525418, 525451, 526 89, 526173, 526183, 526217, 5262181, 5262196, 5263171, 526328, 526341, 526344, 526346, C08J 906, C08F 1606

Patent

active

057123195

ABSTRACT:
A resin composition for low expansion moldings which comprises (A) 20 to 80 parts by weight of a vinyl chloride resin having an average degree of polymerization of from 500 to 1700 and (B) correspondingly from 80 to 20 parts by weight of a copolymer made of 60 to 90 parts by weight a polymerizable monomer mixture consisting of 20 to 40 wt % of acrylonitrile, 20 to 60 wt % of .alpha.-methylstyrene and 20 to 40 wt % of styrene and, correspondingly, 40 to 10 parts by weight of a crosslinked acrylic rubber. The resin composition further comprises (C) 0.5 to 30 parts by weight of an acrylic resin having a reduced viscosity of not less than 3.0 dl/g when measured by use of a chloroform solution of the acrylic resin at a concentration of 0.1 g/100 ml, (D) 0.1 to 10 parts by weight of a thermally decomposable rosining agent, and (E) from 1 to 10 parts by weight of a stabilizer, each based on 100 parts by weight of a mixture of the components (A) and (B).

REFERENCES:
patent: 4434252 (1984-02-01), Dorrestija et al.
patent: 4797426 (1989-01-01), Waki et al.
patent: 4800214 (1989-01-01), Waki et al.

Affiliated with

Also associated with

Rating

Resin composition for low expansion moldings does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin composition for low expansion moldings, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin composition for low expansion moldings will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-342912