Stock material or miscellaneous articles – Printed circuit
Reexamination Certificate
2007-02-20
2007-02-20
Feely, Michael J. (Department: 1712)
Stock material or miscellaneous articles
Printed circuit
C428S297400, C428S413000, C428S414000, C428S415000, C428S416000, C428S417000, C428S418000, C523S400000, C523S427000, C523S428000, C525S523000, C525S524000, C525S529000, C525S530000, C525S532000, C525S533000
Reexamination Certificate
active
10849171
ABSTRACT:
Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board:(A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid state at a temperature of 20° C.;(B) an aromatic epoxy resin having 3 or more epoxy groups in one molecule and an epoxy equivalent of 200 or less;(C) a phenol type curing agent;(D) one or more resins selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, a polyamide resin, a polyamideimide resin, and mixtures thereof, and having a glass transition temperature of 100° C. or more; and(E) an inorganic filler.
REFERENCES:
patent: 5006611 (1991-04-01), Schmid et al.
patent: 6403221 (2002-06-01), Nakamura et al.
patent: 6881293 (2005-04-01), Nakamura et al.
patent: 2004/0099367 (2004-05-01), Nakamura et al.
patent: 61-197624 (1986-09-01), None
patent: 11-087927 (1999-03-01), None
patent: P3108412 (2000-09-01), None
patent: 2001-354936 (2001-12-01), None
patent: WO 01/97582 (2001-12-01), None
Machine translation of JP 2001-354936, provided by the JPO website.
English abstract of JP 61-197624.
English translation of JP 61-197624.
Kawai Kenji
Nakamura Shigeo
Ajinomoto Co. Inc.
Feely Michael J.
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