Resin composition for forming plated layer and use thereof

Details Resin composition for forming plated layer and use thereof Resin composition for forming plated layer and use thereof

1993-10-20

1994-06-28

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524425, 524451, 524492, 524493, 524494, 524607, C08J 508, C08K 318, C08K 322, C08L 7700

Patent

active

053247663

ABSTRACT:
The resin composition for forming plated layer disclosed herein comprises a polyamide composed of a dicarboxylic acid component recuring unit and a recurring unit derived from a diamine component unit having an alkylene group of 4 to 25 carbon atoms and at least one inorganic filler. There are also disclosed the resin molded article having plated layer formed thereon, the electromagnetic wave shielding material, the decorative resin molded article and the connecting material produced by forming plated layer on the surfaces of the resin molded articles formed from said resin composition. Further, there is disclosed the printed circuit board produced by forming selectively metallized layer in wiring circuit portion on the surface of the resin molded article formed from said resin composition and the method for plating to form these articles having the layer plated thereon.

REFERENCES:
patent: 3962524 (1976-06-01), Miyamoto et al.
patent: 4552626 (1985-11-01), Stevenson
patent: 4948868 (1990-08-01), Taguchi et al.

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