Resin composition for encapsulating semiconductor chip and...

Details Resin composition for encapsulating semiconductor chip and... Resin composition for encapsulating semiconductor chip and...

2007-11-06

2007-11-06

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C257S793000, C523S457000, C523S411000

Reexamination Certificate

active

10809182

ABSTRACT:
An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition is disclosed for encapsulating a semiconductor chip containing a phenol aralkyl type epoxy resin containing biphenylene structure(A), a phenol aralkyl type resin containing phenylene or biphenylene structure (B), an inorganic filler (C) and a curing accelerator (D) as main components, further containing a silane coupling agent (E) in 0.01 wt % to 1 wt % both inclusive of the total amount of the epoxy resin composition and a Compound (F) containing two hydroxyl groups combined with each of adjacent carbon atoms on a naphthalene ring in more than or equal to 0.01 wt % of the total amount of the epoxy resin composition.

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Chemical abstracts registry No. 26834-02-6 for a phenol p-xylylene dimethyl ether copolymer, 2003, two pages.

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