Resin composition for encapsulating of semiconductor and semicon

Details Resin composition for encapsulating of semiconductor and semicon Resin composition for encapsulating of semiconductor and semicon

1991-03-01

1993-07-06

Gonzalez, Frank

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525508, 257788, C08F28300

Patent

active

052254992

ABSTRACT:
A resin composition having superior molding character, bonding character, moisture resistance, and heat resistance, for encapsulating of a semiconductor which contains:

REFERENCES:
patent: 3568012 (1971-03-01), Ernst et al.
patent: 4617584 (1986-10-01), Ikeya et al.
patent: 4618878 (1986-10-01), Aoyama et al.
patent: 4900807 (1990-02-01), Nishikawa et al.
patent: 4933744 (1990-06-01), Segawa et al.
patent: 4951122 (1990-08-01), Tsubosaki et al.
patent: 5082880 (1992-01-01), Kitahara et al.
patent: 5134204 (1992-07-01), Toriakai et al.

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