Resin composition containing low-molecular weight compounds whic

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Ethylenically unsaturated reactant admixed with either...

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525440, 525454, 525455, 264240, 2643288, B29C 4500, C08L 7506

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active

053938291

ABSTRACT:
The invention relates to a resin composition containing low-molecular compounds which form a polyester urethane hybrid network. The resin composition contains a first component consisting of a condensation product of at least one diol and at least one unsaturated dicarboxylic acid material, a second component containing an ethylenically unsaturated monomer capable of copolymerizing with the first component, and a third component consisting of a polyisocyanate. The first component substantially consists of a diester compound of 2 diol molecules and 1 molecule of a dicarboxylic acid material, which dicarboxylic acid material consists of at least 75% of .alpha.-, .beta.-unsaturated dicarboxylic acid.

REFERENCES:
patent: 3933728 (1976-01-01), Henbest et al.
patent: 4067845 (1978-01-01), Epel et al.
patent: 4260538 (1981-04-01), Iseler et al.
patent: 4287116 (1981-09-01), Burns
patent: 4822849 (1989-04-01), Vanderlaan
Edwards, H. R., "High Performance Urethane Modified Unsaturated Polyesters," British Plastics Fed. (1984) pp. 37-45.
Edwards, H. R., "The Use of Isophthalic Unsaturated Polyester Urethane Hybrids in Conventional Molding Technique", SPE 44th ANTEC (1986) pp. 1326-1330.
Menges, Injection Des Composants Liquides; Plastiques Modernes et Elastomeres, May 1977, pp. 46-48.
Edwards, H. R., "High Performance Urethane Modified Unsaturated Polyesters", British Plastics Fed. (1984), pp. 37-45.
Edwards, H. R., "The Use of Isophthalic Unsaturated Polyester Urethane Hybrids in Conventional Molding Technique", SPE 44th ANTEC (1986, pp. 1326-1330.

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