Resin composition comprising a polyhydric phenolic hardener

Details Resin composition comprising a polyhydric phenolic hardener Resin composition comprising a polyhydric phenolic hardener

1989-08-24

1990-09-25

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523452, 523453, 523440, 528104, 525523, 525485, C08K 332, C08L 6300

Patent

active

049594001

ABSTRACT:
An epoxy resin composition having exceptional stability which is useful in the preparation of electrical laminates comprises an epoxy resin such as the diglycidyl ether of bisphenol A, an organic solvent, a polyhydric phenolic hardener and an acid having a pKa at 25.degree. C. of less than 2.5 or an ester or anhydride of such acid. The epoxy resin composition can also contain a bishenol or bisphenol derivative such as bisphenol A. In addition, an accelerator such as an alkyl substituted imidazole can also be added to the composition prior to its use as in the preparation of electrical laminates.

REFERENCES:
patent: 4046733 (1977-09-01), Smith et al.
patent: 4331582 (1982-05-01), Babayan
patent: 4366295 (1982-12-01), Tyler, Jr. et al.
patent: 4604317 (1986-08-01), Berman et al.
patent: 4668718 (1987-05-01), Schreiber

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