Resin composition and semiconductor device employing the same

Details Resin composition and semiconductor device employing the same Resin composition and semiconductor device employing the same

1997-11-28

1999-12-07

Dawson, Robert

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525474, C08K 334, C08L 6302

Patent

active

059985097

ABSTRACT:
A resin composition comprising (a) an epoxy compound, (b) a curing agent comprising a polysiloxane resin having a phenolic hydroxyl group on its side chain, and (c) an inorganic filler. The mixing ratio of the inorganic filler should preferably be 10 to 95% by weight based on the entire resin composition.

REFERENCES:
patent: 4720515 (1988-01-01), Iji et al.
patent: 5198520 (1993-03-01), Onishi et al.
patent: 5206312 (1993-04-01), Lia et al.
patent: 5336736 (1994-08-01), Nakano et al.

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