Resin composition and printed circuit board using the same

Details Resin composition and printed circuit board using the same Resin composition and printed circuit board using the same

1997-03-04

1998-03-10

Gulakowski, Randy

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

522100, 522101, 522103, 525507, 525529, 525530, 525531, 525532, 525922, C08F 246, C08F28300

Patent

active

057262195

ABSTRACT:
The present invention provides a rein composition comprising the following components (a), (b), (c), (d) and (e) as essential components; and an excellent multilayer printed circuit board obtained by using the resin composition:
(a) a polyfunctional epoxy resin having an epoxy equivalent of 120-500,
(b) a modified phenol novolac obtained by reacting 20-60 mole % of the phenolic hydroxyl groups of a phenol novolac obtained by condensing a phenol compound with formaldehyde in the presence of an acidic catalyst, with a glycidyl group-containing acrylate or methacrylate,
(c) an epoxy acrylate or epoxy methacrylate compound,
(d) a diluent consisting of a polyfunctional monomer having a plurality of photosensitive functional groups or a polyfunctional monomer having a photosensitive functional group and a heat-sensitive functional group, or a diluent consisting of a combination of the two monomers, and
(e) a photopolymerization initiator.

REFERENCES:
patent: 5098766 (1992-03-01), Gelorme et al.
patent: 5484823 (1996-01-01), Noguchi et al.

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