Resin composition and its use in production of multilayer printe

Details Resin composition and its use in production of multilayer printe Resin composition and its use in production of multilayer printe

1998-11-10

1999-08-10

Breneman, Bruce

Etching a substrate: processes

Forming or treating electrical conductor article

Adhesive or autogenous bonding of self-sustaining preforms

216 18, 216 33, 216105, H01B 1300

Patent

active

059354526

ABSTRACT:
A resin composition comprising (a) an epoxy resin having a number average molecular weight of 1200 or less, (b) a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, (c) a curing agent for the epoxy resin, and (d) a curing accelerator is easily chemically etched and suitable as an insulating adhesive for producing multilayer printed circuit boards.

REFERENCES:
patent: 3471631 (1969-10-01), Quintana
patent: 5591353 (1997-01-01), Davignon et al.

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