Resin composition and flexible printed circuit board

Details Resin composition and flexible printed circuit board Resin composition and flexible printed circuit board

2009-02-23

2010-06-15

Wu, Shean C (Department: 1795)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C524S445000, C524S446000, C524S447000, C524S449000, C524S451000, C252S299010, C252S299500, C428S297400, C428S901000, C174S256000

Reexamination Certificate

active

07737207

ABSTRACT:
A resin composition characterized as containing (A) a synthetic resin having a melting temperature of 300° C. or above and (B) a platy inorganic filler incorporated in the resin and having the following properties;pH of aqueous dispersion: 5.5-8.0,amount of extracted alkalis: Na 30 ppm or below and K 40 ppm or below,maximum diameter a: 50 μm or below,thickness b: 1.0 μm or below, andaspect ratio (a/b): 20 or above.

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English translation by computer for JP 10-226751, http://www4.ipdl.inpit.go.jp/Tokujitu/PAJdetail.ipdl?N0000=60&N0120=01&N2001=2&N3001=H10-226751.

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