Resin composition and adhesive film for multi-layered...

Details Resin composition and adhesive film for multi-layered... Resin composition and adhesive film for multi-layered...

2007-10-16

2007-10-16

Hess, Bruce H. (Department: 1774)

Stock material or miscellaneous articles

Structurally defined web or sheet

Including components having same physical characteristic in...

C428S212000, C428S213000, C428S214000, C428S215000, C524S500000, C524S538000, C156S150000, C156S247000, C156S252000, C156S253000, C156S285000, C156S307100, C216S016000

Reexamination Certificate

active

10875278

ABSTRACT:
The present invention relates to resin compositions that are useful for preparing adhesive films, which are, in turn, useful for forming interlayer insulation layers for multi-layered printed wiring boards having an excellent mechanical strength and capable of being roughened by an oxidizing agent.

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