Resin composition, adhesive film using the same and...

Details Resin composition, adhesive film using the same and... Resin composition, adhesive film using the same and...

2008-03-11

2008-03-11

McClendon, Sanza L. (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Compositions to be polymerized by wave energy wherein said...

C522S173000, C522S181000, C522S113000, C522S116000, C522S134000, C522S135000, C522S142000, C522S151000, C522S152000, C156S090000, C156S330000, C156S327000, C156S349000, C156S379600, C156S330900, C156S331300, C156S331500, C156S331700, C526S336000, C526S335000, C526S072000, C438S118000, C438S106000

Reexamination Certificate

active

11044060

ABSTRACT:
Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a circuit substrate, photo-curing the resin composition, and thermally curing the photo-cured resin composition to thereby form an insulation layer, affords an insulation layer with improved surface smoothness and excellent dielectric properties.

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