Resin composition

Details Resin composition Resin composition

2011-05-10

2011-05-10

Edwards, N. (Department: 1798)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Noninterengaged fiber-containing paper-free web or sheet...

C252S511000, C252S503000, C428S297400, C524S440000, C524S495000, C524S496000

Reexamination Certificate

active

07939167

ABSTRACT:
The present invention provides a resin composition comprising a thermoplastic resin (A), an inorganic compound having a volume resistance of less than about 10−3Ω·m and relative permeability of more than about 5,000 (B) and fiber filler (C). The resin composition of the present invention can have high impact strength and high electrical conductivity, and high electromagnetic interference (EMI) and radio frequency interference (RFI) shielding properties. The resin composition of the present invention can accordingly have multiple functions and can be used for electrical/electronic devices.

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European Search Report in counterpart European Patent Application No. 09180952, dated Feb. 4, 2010.

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