Resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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525486, 525423, 525534, 525526, C08L 7908, C08L 6132, C08L 6300, C08G 7310

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active

052666549

ABSTRACT:
A resin composition for sealing semiconductors which comprises an organic component (A) which contains (a) a polymaleimide compound represented by the formula (I): ##STR1## wherein R.sub.1 is a m-valent organic group having two or more carbon atoms and m is an integer of two or more and (b) a phenolic aralkyl resin represented by the formula (II): ##STR2## wherein X is a divalent group having the formula ##STR3## and n is an integer of from 0 to 100, or contains a mixture of the phenolic aralkyl resin and a phenol, and component (B) which contains an inorganic filler.

REFERENCES:
patent: 3923721 (1975-12-01), Edwards et al.
patent: 5041507 (1991-08-01), Kanagawa
World Patents Index Latest, Week 8940, AN 89-289807, JPA 1-213335, Aug. 28 1989.
Chemical Patents Index, Basic Abstracts Journal, Week 9033, AN 90-251082/33 JPA 2-175709, Jul. 9, 1990.
Chemical Patents Index, Basic Abstracts Journal, Week 9013, AN 90-094623/13 JPA 2-045554, Feb. 15, 1990.
Patent Abstracts of Japan, vol. 13, No. 236, May 30, 1989; JPA 1-045426, Feb. 17, 1989.

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