Resin composition

Details Resin composition Resin composition

2006-10-03

2006-10-03

Woodward, Ana (Department: 1711)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

C525S420000, C525S423000, C525S424000, C525S436000

Reexamination Certificate

active

07115681

ABSTRACT:
The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, soldering heat resistance and retaining ratio of peeling strength after PCT. By forming a circuit using the polyimide resin sheet or the polyimide resin sheet with metal foil, which comprises the resin composition, according to the semi-additive method, a printed wiring board having a good wiring shape, firm adhesion of circuit and high insulating resistance in the microcircuit space can be obtained.

REFERENCES:
patent: 6790930 (2004-09-01), Kikuchi et al.
patent: 09-008458 (1997-01-01), None
patent: 10-107447 (1998-04-01), None
patent: WO 01/34678 (2001-05-01), None

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