Resin-coated mount substrate and method of producing the same

Details Resin-coated mount substrate and method of producing the same Resin-coated mount substrate and method of producing the same

1998-04-23

1999-11-30

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361760, 361764, 361796, 361746, 361728, 361752, 361750, 361748, 361736, 174 50, 174 522, 257678, 26427217, 26427211, 442396, H05K 506

Patent

active

059953748

ABSTRACT:
A substrate unit is constituted by a printed substrate on which electronic parts such as a relay block is mounted, and at least printed circuit conductors and terminals in the printed substrate and relay block are buried in a sealing resin material hardened in a bag-like body of a thin resin film set in an injection mold, and the hardened sealing resin material is then released from the injection mold together with the bag-like body.

REFERENCES:
patent: 3909504 (1975-09-01), Browne
patent: 4942454 (1990-07-01), Mori et al.
patent: 5013900 (1991-05-01), Hoppe
patent: 5051275 (1991-09-01), Wong
patent: 5179039 (1993-01-01), Ishida et al.
patent: 5302850 (1994-04-01), Hara
patent: 5570272 (1996-10-01), Variot
patent: 5739463 (1998-04-01), Diaz et al.

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