Resin-coated bonding device

Stock material or miscellaneous articles – Structurally defined web or sheet – Physical dimension specified

Patent

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Details

428373, 428374, 428375, 428398, 428606, 420507, 420511, 420508, 420509, C22C 502, D02G 300

Patent

active

054159229

ABSTRACT:
A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the wire is characterized as having a tensile strength exceeded when the wire is further elongated in length in a range of 0.5% to 3.5% of its original length by breaking of the wire during tension testing. It has been determined that an insulated bonding fine wire exhibiting such relatively low ductility produces a loop profile maintainable in a stable condition during a bonding operation while providing reliable bonding strength.

REFERENCES:
patent: 4860941 (1989-08-01), Otto

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