Resin board, manufacturing process for resin board,...

Details Resin board, manufacturing process for resin board,... Resin board, manufacturing process for resin board,...

2005-03-15

2005-03-15

Lam, Cathy F. (Department: 1775)

Coating processes

With post-treatment of coating or coating material

Solid treating member or material contacts coating

C427S154000, C427S413000

Reexamination Certificate

active

06866892

ABSTRACT:
A compression function layer60is provided on at least one board surface. The compression function layer60adds a function of being compressed by receiving pressure in the direction of the board thickness to the resin board10which includes this layer. Thereby a sufficient pressure is applied to conductors14.

REFERENCES:
patent: 4640866 (1987-02-01), Suzuki
patent: 4680220 (1987-07-01), Johnson
patent: 4751136 (1988-06-01), Kamiya et al.
patent: 4772509 (1988-09-01), Komada et al.
patent: 4983434 (1991-01-01), Sassa
patent: 5034801 (1991-07-01), Fischer
patent: 5484647 (1996-01-01), Nakatani et al.
patent: 5512360 (1996-04-01), King
patent: 5652055 (1997-07-01), King et al.
patent: 5972482 (1999-10-01), Hatakeyama et al.
patent: 6-268345 (1994-09-01), None

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