Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Reexamination Certificate
2007-01-23
2008-11-18
Tucker, Philip C (Department: 1791)
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Female mold type means
C425S110000, C425S127000
Reexamination Certificate
active
07452197
ABSTRACT:
On an application stage of resin are provided two (2) sets of dispensers20and40. The one dispenser20supplies the resin directing to an upper side corner on a liquid crystal cell1, while the other dispenser40directing to a lower side corner thereon. The dispenser40has a syringe41and a needle-like nozzle42, and the needle-like nozzle42emits the resin, directing upward obliquely, onto the lower side corner. Thereby, the resin can be supplied between an edge portion of a lower substrate and a lower surface of a connecting board, but without turning over the panel for display, such as, a liquid crystal cell, etc.
REFERENCES:
patent: 4054636 (1977-10-01), Menig
patent: 4207049 (1980-06-01), Malo et al.
patent: 4573896 (1986-03-01), Bonzo
patent: 4595351 (1986-06-01), Dickson et al.
patent: 4857376 (1989-08-01), Von Reis et al.
patent: 4914883 (1990-04-01), Wencley
patent: 5188693 (1993-02-01), Nagata et al.
patent: 5322432 (1994-06-01), Gilje
patent: 5338169 (1994-08-01), Buckley
patent: 5477611 (1995-12-01), Sweis et al.
patent: 5512232 (1996-04-01), Addeo et al.
patent: 5651998 (1997-07-01), Bertschi et al.
patent: 5698242 (1997-12-01), Chen et al.
patent: 5798069 (1998-08-01), Bertschi et al.
patent: 5817545 (1998-10-01), Wang et al.
patent: 5851853 (1998-12-01), Lee et al.
patent: 5866442 (1999-02-01), Brand
patent: 5906682 (1999-05-01), Bouras et al.
patent: 5921967 (1999-07-01), Sadowski et al.
patent: 5985029 (1999-11-01), Purcell
patent: 6068809 (2000-05-01), Chen et al.
patent: 6085943 (2000-07-01), Cavallaro et al.
patent: 6173864 (2001-01-01), Reighard et al.
patent: 6203304 (2001-03-01), Lopez Tonazzi et al.
patent: 6245583 (2001-06-01), Amador et al.
patent: RE37341 (2001-08-01), Cornils et al.
patent: 6444035 (2002-09-01), Nowak et al.
patent: 6519032 (2003-02-01), Kuebler et al.
patent: 6554598 (2003-04-01), Tsuruta
patent: 6582993 (2003-06-01), Baba et al.
patent: 6644238 (2003-11-01), Watts et al.
patent: 6739483 (2004-05-01), White et al.
patent: 6770319 (2004-08-01), Baba et al.
patent: 6868347 (2005-03-01), Li et al.
patent: 7128869 (2006-10-01), Habisreitinger et al.
patent: 2001/0013316 (2001-08-01), Watts et al.
patent: 2002/0013316 (2002-01-01), Furuta et al.
patent: 2002/0037363 (2002-03-01), Baba et al.
patent: 2002/0195468 (2002-12-01), White et al.
patent: 2003/0010286 (2003-01-01), Nowak et al.
patent: 2003/0102596 (2003-06-01), Miller
patent: 2004/0021247 (2004-02-01), Habisreitinger et al.
patent: 2004/0101586 (2004-05-01), Kamiya et al.
patent: 11-305245 (1999-11-01), None
Hiraseko Kouji
Onoshiro Jun
Wada Kenya
Antonelli, Terry Stout & Kraus, LLP.
Hitachi High-Technologies Corporation
Malekzadeh Seyed Masoud
Tucker Philip C
LandOfFree
Resin application method on panel, manufacturing method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Resin application method on panel, manufacturing method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin application method on panel, manufacturing method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4034412