Resin and resin composition

Details Resin and resin composition Resin and resin composition

2005-01-18

2008-08-26

Chu, John S (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaged product

Including resin or synthetic polymer

C430S191000, C430S192000, C430S193000, C430S270100, C430S280100, C430S281100, C430S325000, C430S326000, C430S330000, C430S906000, C528S335000, C528S338000

Reexamination Certificate

active

07416822

ABSTRACT:
Disclosed is a hydroxy polyamide represented by the following general formula (1) and having a 5-amino isophthalic acid derivative structure in the main chain structure. (1) (In the formula, m and n represent integers, X represents at least one tetravalent organic group, Y represents at least one divalent organic group having a 5-amino isophthalic acid derivative structure, and Z represents at least one divalent organic group).

REFERENCES:
patent: 2772972 (1956-12-01), Herrick et al.
patent: 2797213 (1957-06-01), Moore
patent: 3669658 (1972-06-01), Yonezawa et al.
patent: 3904589 (1975-09-01), Radlmann et al.
patent: 4339521 (1982-07-01), Ahne et al.
patent: 4395482 (1983-07-01), Ahne et al.
patent: 5077378 (1991-12-01), Mueller et al.
patent: 5376499 (1994-12-01), Hammerschmidt et al.
patent: 5486447 (1996-01-01), Hammerschmidt et al.
patent: 6071666 (2000-06-01), Hirano et al.
patent: 6177225 (2001-01-01), Weber et al.
patent: 6376151 (2002-04-01), Takahashi et al.
patent: 6933087 (2005-08-01), Suwa et al.
patent: 7049371 (2006-05-01), Enoki et al.
patent: 2004/0002572 (2004-01-01), Enoki et al.
patent: 1-046862 (1989-10-01), None
patent: 5-027245 (1993-02-01), None
patent: 5-102125 (1993-04-01), None
patent: 5-197153 (1993-08-01), None
patent: 2002-012665 (2002-01-01), None
patent: 2002-167442 (2002-06-01), None
patent: 2003-105086 (2003-04-01), None
patent: 2003-0053471 (2003-06-01), None
English Language Abstract of JP 2003-105086.
English Language Abstract of JP 2002-167442.
English Language Abstract of JP 5-102125.
English Language Abstract of JP 1-046862.
English Language Abstract of JP 5-027245.
English Language Abstract of JP 2002-012665.
Ommer H.J., et al., “Photocrosslinkable comb-like polymers for membranes: polyamides from modified 5-aminoisophthalic acid and aromatic diamines”. Macromolecular Chemistry and Physics, vol. 197, 1996, pp. 797-809.

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