Resin and metal semiconductor device package and...

Details Resin and metal semiconductor device package and... Resin and metal semiconductor device package and...

2011-07-12

2011-07-12

Smoot, Stephen W (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S668000, C257S690000, C257SE33056, C257SE33066

Reexamination Certificate

active

07977700

ABSTRACT:
A semiconductor package and a semiconductor light-emitting device including the semiconductor package. The semiconductor package includes: a frame for mounting a semiconductor light-emitting element; and a lead integral with the frame. The frame and the lead are made of a resin. A metal film is located in a predetermined area on the frame.

REFERENCES:
patent: 5177593 (1993-01-01), Abe
patent: 5291038 (1994-03-01), Hanamoto et al.
patent: 6091136 (2000-07-01), Jiang et al.
patent: 10-154848 (1998-06-01), None
patent: 11-177150 (1999-07-01), None

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