Resilient polishing pad for chemical mechanical polishing

Details Resilient polishing pad for chemical mechanical polishing Resilient polishing pad for chemical mechanical polishing

2006-09-05

2006-09-05

Rachuba, M. (Department: 3723)

Abrading

Flexible-member tool, per se

Laminate

C451S539000

Reexamination Certificate

active

07101275

ABSTRACT:
A resilient, laminated polishing pad for chemical mechanical polishing is disclosed. The polishing pad includes a base layer and a polishing layer bonded by a hot-melt adhesive. The hot-melt adhesive of the present invention provides a Tpeel strength for the polishing pad of at least greater than 40 Newtons at 305 mm/min, reducing pad delamination.

REFERENCES:
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patent: 5257478 (1993-11-01), Hyde et al.
patent: 5692950 (1997-12-01), Rutherford et al.
patent: 6007407 (1999-12-01), Rutherford et al.
patent: 2004/0102137 (2004-05-01), Allison et al.
patent: 1 046 466 (2000-10-01), None

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