Resilient mold assembly

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

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Details

100211, 100258A, 100295, 26427217, 425121, 425411, 425444, B29C 3910

Patent

active

050591053

ABSTRACT:
A resilient sheet of material is used between a cavity plate and a mold base in a sytem used to encapsulate items such as semiconductor devices. The resilient sheet of material compensates for any dimensional variations in the cavity plates. In addition, compensation is also made for dimensional variations of the item being encapsulated. In one embodiment, the sheet of resilient material is used to seal cavity openings in the cavity plate. A method for the use of such an arrangement is also provided.

REFERENCES:
patent: 3615946 (1971-10-01), Palmer
patent: 3622419 (1971-11-01), London et al.
patent: 3685784 (1972-08-01), Spanjer
patent: 3712575 (1973-01-01), Bement et al.
patent: 4044984 (1977-08-01), Shimizu et al.
patent: 4160639 (1979-07-01), Umeda
patent: 4236689 (1980-12-01), Hass
patent: 4373259 (1983-02-01), Motsch
patent: 4480975 (1984-11-01), Plummer et al.
patent: 4555086 (1985-11-01), Kiyotomo
patent: 4612081 (1986-09-01), Kasper et al.
patent: 4615857 (1986-10-01), Baird
patent: 4701117 (1987-10-01), Takaoka et al.
patent: 4723899 (1988-02-01), Osada
patent: 4738813 (1988-04-01), Finkensiep
patent: 4753160 (1988-06-01), Baird et al.
patent: 4854599 (1989-08-01), Bartack

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