Residue-free solder paste

Details Residue-free solder paste Residue-free solder paste

2005-05-03

2005-05-03

Jenkins, Daniel (Department: 1742)

Metal treatment

Compositions

Fluxing

C148S025000

Reexamination Certificate

active

06887319

ABSTRACT:
A residue-free solder paste which leaves little or no flux residue after reflow soldering and which have good printability, storage stability, retainability of parts, and wettability, comprises a solder powder mixed with a rosin-free pasty flux. The flux comprises at least one solid solvent and at least one highly viscous solvent in a total amount of 30-90 mass %, in addition to at least one liquid solvent, all the solvents vaporizing at a reflow soldering temperature. The flux may further contain 0.5-12% of a thixotropic agent such as a fatty acid amide and 1-15% of an activator selected from organic acids and their amine salts, the thixotropic agent and activator vaporizing in the presence of the solvents while the solvents are vaporizing.

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