Optics: measuring and testing – Material strain analysis – By light interference detector
Reexamination Certificate
2011-02-08
2011-02-08
Toatley, Gregory J (Department: 2877)
Optics: measuring and testing
Material strain analysis
By light interference detector
C356S032000
Reexamination Certificate
active
07884924
ABSTRACT:
A residual stress measuring method capable of measuring residual stress of the surface of an object to be inspected rapidly in a non-destructive non-contact manner, as well as a residual stress measuring system having such characteristics and being high in portability, are provided. The residual stress measuring system comprises a heating laser for heating an inspection area of an object to be inspected, a laser interferometer for irradiating the inspection area interferometric with laser light and measuring a deformation quantity within an elastic deformation range upon stress relief by heating in accordance with a laser interferometric method, and a data processor for measuring residual stress from the deformation quantity within the elastic deformation range upon stress relief of the object to be inspected.
REFERENCES:
patent: 5432595 (1995-07-01), Perchersky
patent: 2005/0052637 (2005-03-01), Shaw et al.
patent: 64-016941 (1989-01-01), None
patent: 6-260799 (1994-09-01), None
patent: 7-218449 (1995-08-01), None
patent: 2001-144402 (2001-05-01), None
patent: 2003-514247 (2003-04-01), None
M. Hayakawa, et al, “Non-destructive Internal Flaw Inspection by Shearography,” Inspection Technique, Nippon Kogyo Shuppan, Published Jun. 1, 2004, vol. 9, No. 6, pp. 21-26.
K. Yamada, et al, “Nondestructive Evaluation Method of Welding Residual Stresses by Heating Method,” vol. 70, No. 699, (Nov. 2004).
G. Kaufmann, et al, “Measurement of residual stresses using local heating and a radial in-plane speckle interferometer,” Optical Engineering vol. 44, (Sep. 2005).
M. Pechersky, “Determination of Residual Stresses by Thermal Relaxation and Speckle Correlation Interferometry,” Blackwell Science Ltd. Strain 2002, 38, pp. 141-149.
Baba Atsushi
Matsui Tetsuya
Numata Shohei
Brundidge & Stanger, P.C.
Hitachi , Ltd.
Toatley Gregory J
Ton Tri T
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