Resealable multichip module and method therefore

Details Resealable multichip module and method therefore Resealable multichip module and method therefore

1994-03-21

1995-12-19

Kincaid, Kristine L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29825, 257704, H05K 506

Patent

active

054770092

ABSTRACT:
A multichip electronic module comprising a base for holding various components and a lid for sealing the module, is temporarily closed by a reworkable seal made from a thermoplastic material. The seal is hermetic so that the module can be tested under ambient conditions approximating actual use. If the module fails the functional test, the lid is easily removed for repair. The thermoplastic material is located in a special grove near the periphery of the base or lid next to the mating surfaces which form part of a final seal for the module. After a module has been repaired, the lid is finally soldered or welded to the base using portions of these mating surfaces which are free of the thermoplastic material. There is no need to remove the thermoplastic material used for the temporary seal.

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