Reroute strategy for high density substrates

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

174260, 174261, 2281802, 361395, 361400, 361403, 361414, 439 48, 257701, H05K 762

Patent

active

052240223

ABSTRACT:
A multilayered electrical interconnect circuit whereby interconnect lines, placed in channel regions throughout a rerouting substrate, function to reroute densely packaged electrical components via geometrically uniform spot links placed upon only the surface layer within each channel region. The interconnect circuit has closely spaced parallel X-and Y-lines orthogonal to one another, each X- and Y-line placed within horizontal and vertical channel regions, respectively, such that electrical connections between closely spaced large-scale integrated circuits or discrete electrical components can be rerouted with a combination of one or more X- and/or Y-lines.

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