Replacing semiconductor chips in a full-width chip array

Details Replacing semiconductor chips in a full-width chip array Replacing semiconductor chips in a full-width chip array

1995-04-03

2000-12-26

Graybill, David E.

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

438 68, 438458, 438462, H01L 2100, H01L 2146, H01L 2130

Patent

active

061658138

ABSTRACT:
Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips.

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R.D. McNutt et al; "Chip Removal and Chip Site Dressing", Jul. 1981; pp. 1288-1289; XP 002029008.
E.J. Harris et al; "LSI Chip Removal and Dressing Tool"; Oct. 1976; pp. 1641-1642; XP 002029009.

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