Repairing fractured wafers in semiconductor manufacturing

Radiation imagery chemistry: process – composition – or product th – Registration or layout process other than color proofing

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438 4, 430 30, 430296, 430942, 430966, G03F 900

Patent

active

059323795

ABSTRACT:
The specification describes a technique for repairing wafer fractures that occur during wafer fabrication. The fractured pieces are joined edge-to-edge at the fracture line and bonded with epoxy adhesive. The method succeeds because the dimensions of the fracture line after bonding is within the reregistration tolerance of commercial step-and-repeat cameras and the reregistration capability of the camera allows normal exposure of sites that do not intersect the fracture line.

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