Repairable wafer scale integration system

Details Repairable wafer scale integration system Repairable wafer scale integration system

1998-08-25

2000-10-17

Graybill, David

Metal working

Barrier layer or semiconductor device making

H01L 2168

Patent

active

06131255&

ABSTRACT:
An apparatus for integrating wafer scale semiconductor integrated circuits and interfacing them with other systems. A wafer, partial wafer, die or plurality of same are mated to a printed circuit board (PCB) which electrically contacts the pads on each die using small conductive pillars. The PCB in turn is connected easily to other electronic systems. The entire apparatus is incorporated into other systems which utilize the dice in the apparatus. The apparatus may be fitted with heating elements and cooling channels to generate the necessary die temperatures for burn-in, testing, and operation. The apparatus is easily adaptable to include more dice in a stacked configuration.

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