Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2008-09-23
2008-09-23
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S719000, C257S778000, C257SE23003, C257SE23078, C257SE23083
Reexamination Certificate
active
11015213
ABSTRACT:
A tightly packed three-dimensional electronic system or subsystem comprising multiple stacks of semiconductor elements is described. The system is repairable because the elements connect together using re-workable flip chip connectors; each flip chip connector comprises a conductive spring element on one side and a corresponding well filled with solder on the other side. The spring elements relieve stresses at the interfaces and allow the component stacks to remain flat; they also provide vertical compliance for easing assembly of elements that have been imperfectly thinned or planarized. Semiconductor integration platforms may be used to integrate active and passive devices, multi-layer interconnections, through wafer connections, I/O plugs, and terminals for attachment of other semiconductor elements or cables.
REFERENCES:
patent: 4455654 (1984-06-01), Bhaskar et al.
patent: 4748495 (1988-05-01), Kucharek
patent: 4862322 (1989-08-01), Bickford et al.
patent: 4912844 (1990-04-01), Parker
patent: 4997791 (1991-03-01), Ohuchi et al.
patent: 5001548 (1991-03-01), Iversen
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5159529 (1992-10-01), Lovgren
patent: 5162974 (1992-11-01), Currie
patent: 5214250 (1993-05-01), Cayson et al.
patent: 5239200 (1993-08-01), Messina et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5267867 (1993-12-01), Agahdel et al.
patent: 5281151 (1994-01-01), Arima et al.
patent: 5290970 (1994-03-01), Currie
patent: 5291064 (1994-03-01), Kurokawa
patent: 5300810 (1994-04-01), Eden
patent: 5305184 (1994-04-01), Andresen et al.
patent: 5334279 (1994-08-01), Gregoire
patent: 5367593 (1994-11-01), Lebby et al.
patent: 5390412 (1995-02-01), Gregoire
patent: 5451722 (1995-09-01), Gregoire
patent: 5461327 (1995-10-01), Shibata et al.
patent: 5510758 (1996-04-01), Fujita et al.
patent: 5579574 (1996-12-01), Colleran et al.
patent: 5627406 (1997-05-01), Pace
patent: 5635767 (1997-06-01), Wenzel et al.
patent: 5640051 (1997-06-01), Tomura et al.
patent: 5701666 (1997-12-01), DeHaven et al.
patent: 5736850 (1998-04-01), Legal
patent: 5774475 (1998-06-01), Qureshi
patent: 5786986 (1998-07-01), Bregman et al.
patent: 5797771 (1998-08-01), Garside
patent: 5800060 (1998-09-01), Speckbrock et al.
patent: 5847936 (1998-12-01), Forehand et al.
patent: 5900738 (1999-05-01), Khandros et al.
patent: 5959462 (1999-09-01), Lum
patent: 5972152 (1999-10-01), Lake et al.
patent: 5986887 (1999-11-01), Smith et al.
patent: 5998738 (1999-12-01), Li et al.
patent: 6005198 (1999-12-01), Gregoire
patent: 6103554 (2000-08-01), Son et al.
patent: 6121676 (2000-09-01), Solberg
patent: 6138348 (2000-10-01), Kulesza et al.
patent: 6161921 (2000-12-01), Bard et al.
patent: 6174804 (2001-01-01), Hsu
patent: 6208511 (2001-03-01), Bortolini et al.
patent: 6210229 (2001-04-01), Lai
patent: 6225688 (2001-05-01), Kim et al.
patent: 6246010 (2001-06-01), Zenner et al.
patent: 6304447 (2001-10-01), Bortolini et al.
patent: 6310484 (2001-10-01), Akram et al.
patent: 6372549 (2002-04-01), Urushima
patent: 6392301 (2002-05-01), Waizman et al.
patent: 6416171 (2002-07-01), Schmidlin
patent: 6441476 (2002-08-01), Emoto
patent: 6460247 (2002-10-01), Gregoire
patent: 6462532 (2002-10-01), Smith
patent: 6476885 (2002-11-01), Murray et al.
patent: 6480395 (2002-11-01), Kopf
patent: 6515870 (2003-02-01), Skinner et al.
patent: 6528891 (2003-03-01), Lin et al.
patent: 6531022 (2003-03-01), Tsukahara
patent: 6587345 (2003-07-01), Chu et al.
patent: 6611057 (2003-08-01), Mikubo et al.
patent: 6631344 (2003-10-01), Kapur et al.
patent: 6677776 (2004-01-01), Akram et al.
patent: 6683377 (2004-01-01), Shim et al.
patent: 6690845 (2004-02-01), Yoshimura et al.
patent: 6717812 (2004-04-01), Pinjala et al.
patent: 6722893 (2004-04-01), Li et al.
patent: 6749587 (2004-06-01), Flaherty
patent: 6763880 (2004-07-01), Shih
patent: 6784554 (2004-08-01), Kajiwara et al.
patent: 6829574 (2004-12-01), Ito et al.
patent: 6845477 (2005-01-01), Hidaka
patent: 6880350 (2005-04-01), Tilton
patent: 6881609 (2005-04-01), Salmon
patent: 6891732 (2005-05-01), Takano et al.
patent: 6927471 (2005-08-01), Salmon
patent: 6938678 (2005-09-01), Bortolini et al.
patent: 6942493 (2005-09-01), Matsunaga et al.
patent: 6955063 (2005-10-01), Adiga et al.
patent: 6956284 (2005-10-01), Cady et al.
patent: 6956285 (2005-10-01), Radu et al.
patent: 6973717 (2005-12-01), Hacke et al.
patent: 6990176 (2006-01-01), Sherman et al.
patent: 7009412 (2006-03-01), Chong et al.
patent: 7018917 (2006-03-01), Elers
patent: 7040383 (2006-05-01), Oyamada
patent: 7078926 (2006-07-01), Khandros et al.
patent: 7163830 (2007-01-01), Salmon et al.
patent: 7180165 (2007-02-01), Ellsberry et al.
patent: 7224856 (2007-05-01), Kathman et al.
patent: 7254024 (2007-08-01), Salmon
patent: 2002/0030975 (2002-03-01), Moon
patent: 2002/0121689 (2002-09-01), Honda
patent: 2003/0035473 (2003-02-01), Takinosawa
patent: 2003/0106004 (2003-06-01), Richetti et al.
patent: 2003/0167144 (2003-09-01), Wang et al.
patent: 2003/0168725 (2003-09-01), Warner et al.
patent: 2004/0012383 (2004-01-01), Kimura
patent: 2004/0148121 (2004-07-01), deObaldi et al.
patent: 2004/0176924 (2004-09-01), Salmon
patent: 2005/0040513 (2005-02-01), Salmon
patent: 2005/0168231 (2005-08-01), Kim
patent: 2005/0184376 (2005-08-01), Salmon
patent: 2005/0255722 (2005-11-01), Salmon
patent: 2006/0077638 (2006-04-01), Salmon
patent: 2006/0145715 (2006-07-01), Salmon
patent: 2006/0209512 (2006-09-01), Taniguchi et al.
patent: 2007/0007983 (2007-01-01), Salmon
patent: 2007/0023889 (2007-02-01), Salmon
patent: 2007/0023904 (2007-02-01), Salmon
patent: 2007/0023923 (2007-02-01), Salmon
patent: 2007/0025079 (2007-02-01), Salmon
patent: 07169873 (1995-07-01), None
Chow, Eugene M. et al., “Process Compatible Polysilicon-Based Electrical Through-Wafer Interconnects in Silicon Substrates”,Journal of Microelectromechanical Systems, Vo. 11, No. 6, Dec. 2002, pp. 631-640.
Gutmann, R. J. et al., “Wafer-Level Three-Dimensional ICs: A Better Solution Than SoCs and SiPs?”, 6 pgs.
Davis & Arledge, “Thin Film Metallization of Three Dimensional Substrates,” Electronic Components Technology Conference, Proceedings 44th, pp. 359-361, May 1-4, 1994.
Holden, Happy, “A Design Technology Innovation—The Power Mesh Architecture for PCBs”, The Board Authority, Dec. 2000, pp. 2-6.
Kreider, Kenneth G. et al., “High Temperature Materials For Thin-Film Thermocouples On Silicon Wafers”, Chemical Science and Technology Laboratory, NIST, Gaithersburg, Maryland, USA , date unknown.
Sensu, Yoshihisa et al., “Study on Improved Resolution of Thick Film Resist (Verification by Simulation)”, SPIE, 2001.
Dorsey & Whitney LLP
Pert Evan
Salmon Technologies, LLC
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