Repairable flip-chip bumping

Details Repairable flip-chip bumping Repairable flip-chip bumping

1988-03-28

1989-04-04

Godici, Nicholas P.

Metal fusion bonding

Process

Repairing, restoring, or renewing product for reuse

2281802, 29834, 29840, B23K 3102

Patent

active

048178500

ABSTRACT:
A substrate contact structure which includes a plurality of contact pads formed on a surface of the substrate and located for receiving a predetermined integrated circuit chip or die having conductive bonding bumps corresponding to and respectively associated with the plurality of contact pads. Each of the contact pads includes a plurality of bonding sites, wherein the pattern of bonding sites is substantially identical for each of the contact pads. Each bonding site has corresponding bonding sites on the other contact pads which cooperatively form sets of bonding sites, each of which is a mirror image of the conductive bonding bumps on the predetermined integrated circuit chip. Methods of producing substrates suitable for removal and replacement of bump bonded integrated circuit chips, as well as methods of repair of such structures are also disclosed.

REFERENCES:
patent: 3672034 (1972-06-01), Clark
patent: 4582975 (1986-04-01), Daughton

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