Repairable electronic circuit package

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

165 803, 165185, 257718, 361715, H05H 720

Patent

active

054249198

ABSTRACT:
A dismountable, materially separable circuit package is made up by stacking pairs of heat sink, carrier, and bridge components in a back to back fashion. The package is mechanically clamped to form pressure clamped contact of the circuit components. Such piggy-back packaging reduces space requirements by approximately fifty percent. Pressure clamping provides a demountable, repairable structure.

REFERENCES:
patent: 4636917 (1987-01-01), Jouanny
patent: 4716498 (1987-12-01), Ellis
patent: 4812949 (1989-03-01), Fontan et al.
patent: 4853828 (1989-08-01), Penn
patent: 5157588 (1992-10-01), Kim et al.

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