Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-07-25
2006-07-25
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S704000, C257S713000, C257S722000, C361S703000, C361S719000
Reexamination Certificate
active
07082033
ABSTRACT:
A cover, acting as a heat sink for integrated circuit devices, encloses one or more devices mounted on a support structure. The thermally conductive cover is formed of a thermally conductive material and is also sealed to the support structure. By thermally contacting the cover to the integrated circuit devices, heat is dissipated from the integrated circuit devices. A thermally conductive paste can be applied between the cover and integrated circuit devices to facilitate heat transfer from the integrated circuit devices to the cover.
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Thompson Gregory D
Trop Pruner & Hu P.C.
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