Removing bubbles from small cavities

Details Removing bubbles from small cavities Removing bubbles from small cavities

1993-07-26

1994-11-29

Niebling, John

Gas separation: processes

Degasification of liquid

By liquid flow modifying or mechanical agitating

205 88, 205205, 95266, 427299, 427444, 134 2212, B06B 110

Patent

active

053686349

ABSTRACT:
Bubbles are removed from small cavities, such as blind via holes in a semiconductor wafer, by immersing the article having the cavities in a liquid medium. A wetting agent is preferably present in the liquid medium. A vacuum is applied to the liquid medium, and the vacuum is vented to air. The application of vacuum and venting are repeated several times, causing the bubbles to be drawn from the cavities and to dislodge from the surface of the article. The bubbles float free, and processing within the cavities can commence.

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