Removal of semiconductor wafers from dicing film

Details Removal of semiconductor wafers from dicing film Removal of semiconductor wafers from dicing film

1983-12-19

1987-05-12

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

29583, 156235, 156248, 156249, 156264, 1563073, 264345, B32B 3126

Patent

active

046647392

ABSTRACT:
Semiconductor chips, which have been diced, can be removed from the conductive adhesive/polymer support film holding them, without leaving residual adhesive on the film if the wafer/adhesive support film laminate is heated prior to the dicing step. The heating step increases the release characteristics between the adhesive and film.

REFERENCES:
patent: 3600246 (1971-08-01), Breen
patent: 3784433 (1974-01-01), Garnish et al.

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