Removal of RTV silicon rubber encapsulants

Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

134 30, 156657, 156668, 252 795, H01L 2330

Patent

active

040897044

ABSTRACT:
Disclosed is a method of removing silicone rubber encapsulating material from micro-electronic circuits. The encapsulant is broken down molecularly and removed by a solution of tetramethyl-ammonium hydroxide which is diluted with an alcohol such as 2-propanol. It was found that this stripping solution causes minimal swelling of the encapsulant and leaves no significant residue which cannot be removed by standard rinsing.

REFERENCES:
patent: 2710843 (1955-06-01), Stebleton
patent: 3551204 (1970-12-01), Bolger et al.
patent: 3673099 (1972-06-01), Corby et al.
patent: 3915769 (1975-10-01), Moore
patent: 3947952 (1976-04-01), Miller et al.
patent: 3969813 (1976-07-01), Minetti et al.
patent: 4017495 (1977-04-01), Jaffe et al.
Rose et al., Ed. The Condensed Chemical Dictionary, 7th ed, Reinhold Publishing Corp., New York, N.Y. (1966), p. 844.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Removal of RTV silicon rubber encapsulants does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Removal of RTV silicon rubber encapsulants, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Removal of RTV silicon rubber encapsulants will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1196006

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.