Removal of polyimide from dies and wafers

Details Removal of polyimide from dies and wafers Removal of polyimide from dies and wafers

1997-01-02

1999-07-20

Breneman, R. Bruce

Etching a substrate: processes

Forming or treating fibrous article or fiber reinforced...

216 85, 438 8, 438 15, B32B 3100

Patent

active

059252600

ABSTRACT:
Polyimide is used with a semiconductor wafer with a number of dies with circuitry formed thereon. A layer of polyimide is formed on the semiconductor wafer. The wafer is inspected to determine whether the layer of polyimide was formed in a desired pattern. Based on the results of the inspection, the layer of polyimide is removed. A layer of polyimide is removed from a semiconductor substrate with circuitry formed thereon. The semiconductor substrate is provided in a container with a solvent. Energy is introduced to the substrate from a frequency-based energy source. A rinse agent is applied to the substrate.

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