Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2005-09-13
2005-09-13
Webb, Gregory (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S175000, C134S001300, C134S002000, C134S003000, C438S692000, C438S745000
Reexamination Certificate
active
06943139
ABSTRACT:
A cleaning composition for cleaning particulate contamination from small dimensions on semiconductor substrates. The cleaning composition contains supercritical CO2(SCCO2), alcohol, fluoride source and, optionally, hydroxyl additive. Such cleaning composition overcomes the intrinsic deficiency of SCCO2 as a cleaning reagent, viz., the non-polar character of SCCO2 and its associated inability to solubilize species such as inorganic salts and polar organic compounds that are present in particulate contamination on wafer substrates and that must be removed from the semiconductor substrate for efficient cleaning. The cleaning composition enables damage-free, residue-free cleaning of substrates having particulate contamination on Si/SiO2substrates.
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Baum Thomas H.
Ghenciu Eliodor G.
Korzenski Michael B.
Xu Chongying
Advanced Technology & Materials Inc.
Chappuis Margaret
Fuierer Tristan A.
Hultquist Steven J.
Webb Gregory
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