Removal of copper contamination from tin plating baths

Details Removal of copper contamination from tin plating baths Removal of copper contamination from tin plating baths

1982-03-29

1983-09-20

Andrews, M. J.

Chemistry: electrical and wave energy

Processes and products

204120, 204DIG13, C25D 332

Patent

active

044054122

ABSTRACT:
A method for removing copper contaminants from acid electroplating baths comprising adding to the bath sodium formaldehyde sulfoxylate. The presence of the sodium formaldehyde sulfoxylate overcomes overall plating haze and low current density dullness due to copper contamination in the acid tin bath.

REFERENCES:
patent: 4168223 (1979-09-01), Igarashi et al.
patent: 4187166 (1980-02-01), Kruper
patent: 4347107 (1982-08-01), Teichmann et al.

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