Removal of coating from periphery of a semiconductor wafer

Details Removal of coating from periphery of a semiconductor wafer Removal of coating from periphery of a semiconductor wafer

1983-09-26

1985-04-09

Kittle, John E.

Coating processes

Electrical product produced

Condenser or capacitor

427240, 427273, 118 52, 134 33, B05D 512, B05C 1112

Patent

active

045101760

ABSTRACT:
The specification describes techniques for removing the edge bead region from a coated semiconductor wafer by directing a jet of solvent at the wafer periphery while the wafer is spinning. The flow patterns of debris resulting from this removal are controlled to prevent contamination of the chip sites on the wafer.

REFERENCES:
patent: 4113492 (1978-09-01), Sato et al.
patent: 4393807 (1983-07-01), Fujimura et al.

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