Electrical connectors – With guiding means for mating of coupling part – Rodlike guide member extending in coupling direction or...
Utility Patent
1999-11-10
2001-01-02
Paumen, Gary F. (Department: 2833)
Electrical connectors
With guiding means for mating of coupling part
Rodlike guide member extending in coupling direction or...
C439S892000, C439S374000, C439S149000
Utility Patent
active
06168454
ABSTRACT:
BACKGROUND OF THE INVENTION
U.S. Pat. No. 5,348,488 shows an organizer The organizer has holes that accommodate large pins. The large pins are inserted into a motherboard. The organizer cannot be removed from around the large pins, after the large pins have been inserted into the mother board.
An integrated circuit chip carrier could be designed to have slender pins. Such a chip carrier could hold an integrated circuit chip. The slender pins of the chip carrier could have a diameter of from 0.006 inches to 0.010 inches. Such a chip carrier could be electrically connected to a circuit board.
The advantage of using a chip carrier that has slender pins, is that when the slender pins are heated or cooled, the slender pins will exert less force between the chip carrier and the circuit board than would thicker and shorter pins. Also, the slender pins would undergo less bending stress.
A removable pin stabilizer, for stabilizing slender pins, is disclosed. Such a removable pin stabilizer could stabilize slender pins of an integrated circuit chip carrier. A removable pin stabilizer would have holes that are of a size needed to guide and protect the slender pins from being bent before and during placement of the pins into sockets of a circuit board. For holding slender pins having a diameter from 0.006 inches to 0.010 inches, the diameter of the holes might be 0.001 inches larger, in diameter.
Again, holes in a removable pin stabilizer have a proper size to guide and protect slender pins of the integrated circuit chip carrier, as the slender pins are placed into sockets of a circuit board. The holes would have a diameter from 0.007 inches to 0.011 inches, to respectively accept slender pins having a diameter of from 0.006 to 0.010 inches.
The slender pins of an integrated circuit chip carrier would not easily bend during mounting of the slender pins into sockets of a circuit board, due to the pin stabilizer.
A removable pin stabilizer, for stabilizing slender pins, is contemplated, and is herein disclosed.
A removable pin stabilizer will stabilize and protect slender pins of the integrated circuit chip carrier, before and as slender pins of the chip carrier are mounted into sockets of a circuit board. The removable pin stabilizer would be removed after mounting of the slender pins of a chip carrier into sockets of a circuit board. After mounting, the removable pin stabilizer would be removed from around the slender pins. An increased amount of cooling air might circulate between the chip carrier and the circuit board, due to removal of the removable pin stabilizer from a position between the mounted chip carrier and the circuit board, to better cool the chip carrier and a chip on the chip carrier. After removal, a comparatively large opening would permit the free flow of air or permit application of cleansing agents, and would aid visual inspection.
Again, a removable pin stabilizer would protect slender pins of a chip carrier, the slender pins otherwise being easily bent prior to mounting, or during mounting, of a chip carrier onto sockets of a circuit board. Such slender pins might have a small diameter, such as a diameter from 0.006 inches to 0.010 inches. Such slender pins could be easily bent during mounting of the chip carrier into sockets of a circuit board were it not for use of a removable pin stabilizer. The removable pin stabilizer could be removed to allow the carrier and an integrated circuit chip that the carrier carries, to be air cooled by an increased amount.
A removable pin stabilizer assembly is disclosed. Such a removable pin stabilizer could include a chip carrier, an integrated circuit chip on the chip carrier, a package lid over the integrated circuit chip, a removable pin stabilizer around slender pins of the chip carrier, and a circuit board into sockets of which the slender pins have been placed. The removable pin stabilizer is first placed around slender pins of an integrated circuit chip carrier, near the free ends of the pins. After the slender pins of the integrated circuit chip carrier have been pushed into electrical sockets of the circuit board, to complete the electrical connection of the chip carrier, the chip carrier stands off of the circuit board and the removable pin stabilizer is removed. Additional space is created between the chip carrier and the circuit board by removal of the pin stabilizer from around the pins. More air will circulate due to this increased space. The greater air flow will better cool the chip and chip carrier.
A removable pin stabilizer would initially be located around slender pins of an integrated circuit chip carrier, near the ends of the slender pins. The stabilizer could be made in a thick version with conical holes to direct ends of severely distorted pins into alignment. As the slender pins are pushed into the electrical sockets of the circuit board, the removable pin stabilizer retreats or recedes to a position just below the chip carrier of the pin stabilizer assembly. As the pins are pushed into the sockets the pin stabilizer comes in contact with the circuit board that is below the pin stabilizer.
All or part of the removable pin stabilizer can be made from a dissolvable or meltable material. The entire removable pin stabilizer, or a portion that is the width of the holes, for example, and forms a channel connecting the holes, can be dissolved in a solvent or melted after the chip carrier is mounted and positioned correctly to the circuit board. The resultant additional space created by such removal will allow an increased flow of air between the integrated circuit chip carrier and the circuit board. This flowing air cools the integrated circuit chip carrier.
SUMMARY OF THE INVENTION
A removable pin stabilizer, comprising a non-dissolvable plate, the non-dissolvable plate having parallel dissolvable sections traversing the plate, the parallel dissolvable sections being through the plate, holes through the plate, the holes encompassing the parallel dissolvable sections.
REFERENCES:
patent: 4394795 (1983-07-01), Goss
patent: 4655516 (1987-04-01), Shaffer et al.
patent: 4776804 (1988-10-01), Johnson et al.
patent: 4872845 (1989-10-01), Korsunsky et al.
patent: 5090927 (1992-02-01), McAnany
patent: 5348488 (1994-09-01), Green
Hollis Darrell E.
Paumen Gary F.
Ta Tho D.
Tarlano John
The United States of America as represented by the Secretary of
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