Removable passivating polyimide coating and methods of use

Details Removable passivating polyimide coating and methods of use Removable passivating polyimide coating and methods of use

1996-06-07

1999-10-26

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

2940701, 29424, 156 74, 1563315, 525419, B32B 3100

Patent

active

059721456

ABSTRACT:
Disclosed is the use of a removable passivating layer in multichip packaging and CUBE applications. The process takes advantage of the fact that various metal ions will react with the carboxylic acid groups of various polyimide precursors. The polyimide will cure at a first temperature and the system may be manipulated and tested. At a later point, the polyimide is subjected to a second, higher temperature in order to decompose or completely destroy the polyimide.

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