Removable package underside device attach

Details Removable package underside device attach Removable package underside device attach

2008-12-30

2010-06-01

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S700000, C361S707000, C361S719000, C361S735000, C361S790000, C257S719000, C257S727000, C165S080300

Reexamination Certificate

active

07729121

ABSTRACT:
In some embodiments, a stacked package assembly may include a first socket defining an interior cavity, a first semiconductor device coupled to the first socket, a second socket positioned within the interior cavity of the first socket, and a second semiconductor device removably coupled to the second socket within the cavity of the first socket. The second socket may be positioned between the first semiconductor device and the second semiconductor device and provide an electrical connection between the first semiconductor device and the second semiconductor device. Other embodiments are disclosed and claimed.

REFERENCES:
patent: 5309324 (1994-05-01), Herandez et al.
patent: 5831825 (1998-11-01), Fromont
patent: 6392887 (2002-05-01), Day et al.
patent: 6750551 (2004-06-01), Frutschy et al.
patent: 6862186 (2005-03-01), Belady et al.
patent: 7280365 (2007-10-01), Belson et al.
patent: 7428154 (2008-09-01), Ishimine et al.

Affiliated with

Also associated with

Rating

Removable package underside device attach does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Removable package underside device attach, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Removable package underside device attach will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4174477