Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2008-01-04
2010-06-22
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C257SE21122, C257SE21499
Reexamination Certificate
active
07741194
ABSTRACT:
A method (200) is described for an electronic assembly (30). An electronic die (24) with a sacrificial layer (28) on its back (27) and electrical contacts (26) on its front (25) is temporarily attached by its front (25) to a substrate (32). The back (27) is over-molded by a first material (34) extending over the substrate (32). The substrate (32) is removed leaving the die contacts (26) and the first material (33, 34) exposed. Interconnect layer(s) (44, 64) are provided over the first material (33, 34) and the die (24), electrically coupled to the contacts (26). Further components (66) can be coupled to the upper-most interconnects (64, 53). A second material (68) is over-molded over the components (66) and upper-most interconnects (64, 53). Thinning the first material (34) exposes the sacrificial layer (28) for removal. The die back (27) and vias (70) in the first material (34) extending to the first interconnect layer (43-2) laterally outside the die (24) are filled with a conductor (72, 72′, 73), providing single surface electrical and thermal contact (73-1, 73-2), separated by just the die thickness from heat generating regions of the die (24).
REFERENCES:
patent: 4246595 (1981-01-01), Noyori et al.
patent: 6838776 (2005-01-01), Leal et al.
patent: 6921975 (2005-07-01), Leal et al.
patent: 7045391 (2006-05-01), Lin
patent: 2007/0284704 (2007-12-01), Leal et al.
Coleman W. David
Freescale Semiconductor Inc.
Ingrassia Fisher & Lorenz P.C.
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