Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Patent
1993-09-30
1995-11-14
Pirlot, David L.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
439 67, 439493, 439498, H01R 909
Patent
active
054661625
ABSTRACT:
An electrical connector made of overlapping layers of flexible film 8 carrying conductive traces 9 for interconnecting pins 1 to connection pads 10 on a printed circuit board surface 2a. Cylindrical elastomeric bodies 11 having parallel spaced apart conductors 25 thereon connect the traces 9 to the pads 10. Pins 1 impinge a rigid backing plate 18 upon axial forces to the pins 1 which resists axial movement of the pins 1 relative to solder joints 19 between the pins 1 and the traces 9.
REFERENCES:
patent: 3113248 (1963-12-01), Friedman
patent: 3573704 (1971-04-01), Tarver
patent: 3878341 (1975-04-01), Balde
patent: 3985413 (1976-10-01), Evans
patent: 4116516 (1978-09-01), Griffin
patent: 4552420 (1985-11-01), Eigenbrode
patent: 4659155 (1987-04-01), Walkup et al.
patent: 4682828 (1987-07-01), Piper et al.
patent: 4861272 (1989-08-01), Clark
patent: 4881901 (1989-11-01), Mendenhall et al.
patent: 4902236 (1990-02-01), Hasircoglu
patent: 4948379 (1990-08-01), Evans
patent: 4959030 (1990-09-01), Tatebe et al.
patent: 5007842 (1991-04-01), Deak et al.
patent: 5026291 (1991-06-01), David
patent: 5154618 (1992-10-01), Nikoloff et al.
patent: 5156553 (1992-10-01), Katsumata et al.
patent: 5161986 (1992-11-01), Gulbranson et al.
patent: 5167511 (1992-12-01), Krajewski et al.
patent: 5186632 (1993-02-01), Horton et al.
patent: 5194010 (1993-03-01), Dambach et al.
patent: 5199881 (1993-04-01), Oshita et al.
patent: 5348482 (1994-09-01), Rudy, Jr. et al.
Southard, Hard-speed Signal Pathways From Board To Board, Sep. 15, 1981, pp. 7-8, p. 8 Fig. 18.
Rhoads & Sigmon, Signal Transmission Considerations for a Connector in Digital Input/Output Applications, 1987, pp. 8-10, p. 10 Fig. 12.
Schroepfer Richard C.
Smith Tracy L.
McCarthy Kevin D.
Pirlot David L.
The Whitaker Corporation
Wittels Daniel
LandOfFree
Removable high density connector does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Removable high density connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Removable high density connector will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1217277