Removable heat sink assembly process for a chip package

Details Removable heat sink assembly process for a chip package Removable heat sink assembly process for a chip package

1996-05-02

1998-06-30

Bryant, David P.

Metal working

Method of mechanical manufacture

Assembling or joining

B23P 1102

Patent

active

057715599

ABSTRACT:
The process of the invention employs a post type fastening member that provides, at one end, an insertion friction connection to the circuit card and at the other end, extending through the heat sink, a compression spring means that urges the heat sink toward the cirduit card. A plurality of the post type fasteners are positioned around the periphery of the chip package to retain the heat sink parallel to the circuit card and compressing the chip package. The packaging structure of the invention permits larger area heat sinks than the chip package area to be supported by the circuit card with the only relationship with the chip being that of a compression thermal transfer contact and radiation shield.

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