Removable heat sink assembly for a chip package

Details Removable heat sink assembly for a chip package Removable heat sink assembly for a chip package

1995-03-16

1996-12-17

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

24297, 24453, 248509, 257719, 361704, 411508, 411907, H05K 720

Patent

active

055860052

ABSTRACT:
The invention employs a post type fastening member that provides, at one end, an insertion friction connection to the circuit card and at the other end, extending through the heat sink, a compression spring means that urges the heat sink toward the circuit card. A plurality of the post type fasteners are positioned around the periphery of the chip package to retain the heat sink parallel to the circuit card and compressing the chip package. The packaging structure of the invention permits larger area heat sinks than the chip package area to be supported by the circuit card with the only relationship with the chip being that of a compression thermal transfer contact and radiation shield.

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