Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-09-04
2007-09-04
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S125000, C438S126000, C257S679000, C257SE23064
Reexamination Certificate
active
10913868
ABSTRACT:
A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.
REFERENCES:
patent: 6444501 (2002-09-01), Bolken
patent: 6462273 (2002-10-01), Corisis et al.
patent: 6570825 (2003-05-01), Miranda et al.
patent: 6580615 (2003-06-01), Nakanishi et al.
patent: 6740964 (2004-05-01), Sasaki
patent: 6924547 (2005-08-01), Kanemoto et al.
patent: 7089661 (2006-08-01), Fong et al.
patent: 2002/0186549 (2002-12-01), Bolken
patent: 2004/0066693 (2004-04-01), Osako et al.
Hsueh Paul
Ni Jim
See Sun-Teck
Wang Kuang-Yu
Johnson Larry D.
Thai Luan
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